- 1983
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Shuttle established
- 1984
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Began manufacturing motherboards
- 1988
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Established the first branch office in US
- 1990
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Established the second branch office in Germany
- 1995
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Acknowledged as the world's 5th largest motherboard manufacturer
- 1997
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Established 3,000-pings up-to-dated production facilities in Taiwan
- 1998
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Developed the world's first 17x17cm motherboard for OEM
- 2000
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Shuttle, Inc. (TAIEX: 2405) publicly listed on the Taiwan Stock Market
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ISO-14001 Certified
- 2001
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Introduced the world's first Small Form Factor PC-XPC
- 2002
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Introduced the patent of heat-pipe cooling solution– ‘ICE’ (Integrated Cooling Engine)
- 2003
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The XPC was popular worldwide, ‘barebone’ and ‘XPC’ were synonym
- 2004
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Established the third branch office in Japan
-
Launched the first LCD (XP17) and complete system PC
-
Shipped over one-million XPC in the world
- 2005
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Lead free process implement
-
Established the fourth branch office in China
-
Launched Media Center XPC
-
Shuttle wins IF, Reddot and National Golden Quality Award
- 2006
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Introduced the first slim type XPC
-
IDG selected Shuttle as the no.5 climber in the international brand awareness survey 2006
-
PCWorld selects Shuttle as the 15th great landmark in PC history
- 2007
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Introduced XPC Prima, Glamor and D'VO series
-
Won 2007 BCN Award Bare-bone PC section Top prize in Japan
- 2008
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Implemented Green concept into whole series products
-
Launched surveillance concept product
- 2009
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The first all in one PC- X50 launched
-
Home Automation product development
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IPC product development
- 2010
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Established OEM Business Unit and launched mobile solutions based on the new Shuttle New Notebook Ecosystem
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Launched eSPA Online Notebook Ordering System
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Launched brand new 1 liter fan-less mini-PC XS35 series
- 2011
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Introduced BTR(Build-To-Request) solution to the PC Industry
